Difference between revisions of "NX8MMINI-D168"
From ICOP tech wiki
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+ | ====== I/O: 10S(Max.)/2U/LAN/LPT/2CAN/2I2C/16ADC 12bit/HDA/2PCIE x1/120GPIO(Max.)/SD or eMMC ====== | ||
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Revision as of 10:38, 11 April 2022
NX8MM-D168 |
I/O: 10S(Max.)/2U/LAN/LPT/2CAN/2I2C/16ADC 12bit/HDA/2PCIE x1/120GPIO(Max.)/SD or eMMC
NX8MMINI-D168 IntroductionProviding an extremely small size board(35.00mm × 55.00mm), ICOP Technology launches a new ARM Cortex-A53 solution - NX8MMINI-D168. Equipping the NXP i.MX 8M Mini on ICOP’s unique DIP-168 module and provides an extensive I/O functions on board. The NX8MMINI-D168 provides I/O such as GPIO, UART, SD, DSI, CSI and High-quality audio based on S/PDIF or any interface based on SAI. For display, the IMX8MM-DIP168 supports up to 1080p encode and decode acceleration, 2D and 3D graphics.
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Specifications |
CPU |
NXP i.MX 8M Mini: Up to 4 × Cortex-A53 1.6GHz 1 × Cortex™-M4 |
Memory |
1/2/4 GB LPDDR4 |
GPU |
GC NanoUltra 3D (1 shader) GC320 2D OpenGL ES 2.0 |
Display |
MIPI-DSI up to 1080p60 |
Storage |
eMMC 16GB by default (up to 64GB) |
Network |
Ethernet: 10/100/1000 Mbps |
RTC |
On the carrier board |
I2C |
×4 |
SPI |
×3 |
UARTs |
×4 |
USB |
2 × USB 2.0 OTG, |
BUS |
PCIe |
Audio |
Headphone, |
Temperature Range |
0° to 60° C or -40° to 85° C (Optional) |
Dimensions |
35.00mm × 55.00mm |
Yocto |
Sumo (kernel 4.14.98) Development |
Android |
Pie 9.0 (kernel 4.14.98) Development |