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     <td>NX8MM-D168</td>
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     <td>NX8MM-D168
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         <b><big>NX8MMINI-D168 Introduction</big></b>
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         <b><big>Features</big></b>
 
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         Providing an extremely small size board(35.00mm × 55.00mm), ICOP Technology launches a new ARM Cortex-A53 solution - NX8MMINI-D168. Equipping the NXP i.MX 8M Mini on ICOP’s unique DIP-168 module and provides an extensive I/O functions on board. The NX8MMINI-D168 provides I/O such as GPIO, UART, SD, DSI, CSI and High-quality audio based on S/PDIF or any interface based on SAI. For display, the IMX8MM-DIP168 supports up to 1080p encode and decode acceleration, 2D and 3D graphics.
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#<p style="text-align: justify; line-height: 2;">        NXP i.MX 8M Mini Up to 4 × Cortex-A53 1.6GHz+ 1 × Cortex™-M4      </p>
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       </p>
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#<p style="text-align: justify; line-height: 2;">        I/O:4S/4U/GLAN/I2C/SPI/mPCIe/Wi-Fi/BT/MIPI-CSI/16bitGPIO/audio/MIPI-DSI or HDMI      </p>
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#<p style="text-align: justify; line-height: 2;">        RAM: 2/4 GB LPDDR4      </p>
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        <li>For more information such as datasheet about this product please click.</li>
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#<p style="text-align: justify; line-height: 2;">        Small size: 35mm x 55mm       </p>
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        <li>Join the [http://community.nxp.com/community/imx/content professional technical forum] about NXP i.MX 8M Mini.</li>
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#<p style="text-align: justify; line-height: 2;">        Working temp.: -20° to 70° C or -40° to 85° C (Optional)       </p><p style="text-align: justify; line-height: 2;">               </p>
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         <li>Check the [[Media:NX8MM-D168 BLOCK DIAGRAM.PNG|block diagram]]</li>
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         <li>[http://wiki.icop.com.tw/product/images/2/23/NX8MM-D168_Datasheet-r1.pdf Brochure]</li><li>[[ODM OEM|ODM/OEM project]]
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<br />      
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<li>Join the [http://community.nxp.com/community/imx/content professional technical forum] about NXP i.MX 8M Mini.
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</li>
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         <li>[[Media:NX8MM-D168 BLOCK DIAGRAM.PNG|Block diagram]]</li>
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         <li>[http://wiki.icop.com.tw/product/images/2/23/NX8MM-D168_Datasheet-r1.pdf Brochure](Dimension/Spec/Block diagram)</li><li>[[ODM OEM|ODM/OEM project]]
 
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         <td><p><b>Temperature Range</b></p></td>
 
         <td><p><b>Temperature Range</b></p></td>
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         <td><p>0° to 60° C or</p>
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         <td><p>-20° to 70° C or</p>
 
           <p>-40° to 85° C (Optional)</p>
 
           <p>-40° to 85° C (Optional)</p>
 
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Latest revision as of 11:37, 11 April 2022

NX8MM-D168


Buy sample.png

Features

  1. NXP i.MX 8M Mini Up to 4 × Cortex-A53 1.6GHz+ 1 × Cortex™-M4

  2. I/O:4S/4U/GLAN/I2C/SPI/mPCIe/Wi-Fi/BT/MIPI-CSI/16bitGPIO/audio/MIPI-DSI or HDMI

  3. RAM: 2/4 GB LPDDR4

  4. Small size: 35mm x 55mm

  5. Working temp.: -20° to 70° C or -40° to 85° C (Optional)


  • Join the professional technical forum about NXP i.MX 8M Mini.
  • Block diagram
  • Brochure(Dimension/Spec/Block diagram)
  • ODM/OEM project


    • Specifications

    CPU

    NXP i.MX 8M Mini:

    Up to 4 × Cortex-A53 1.6GHz

    1 × Cortex™-M4

    Memory

    1/2/4 GB LPDDR4

    GPU

    GC NanoUltra 3D (1 shader) GC320 2D OpenGL ES 2.0

    Display

    MIPI-DSI up to 1080p60

    Storage

    eMMC 16GB by default (up to 64GB)
    SD card x2

    Network

    Ethernet: 10/100/1000 Mbps

    RTC

    On the carrier board

    I2C

    ×4

    SPI

    ×3

    UARTs

    ×4

    USB

    2 × USB 2.0 OTG,

    BUS

    PCIe

    Audio

    Headphone,
    Digital/Analog stereo Microphone,
    I2S(SAI), SPDIF, Line In/Out

    Temperature Range

    -20° to 70° C or

    -40° to 85° C (Optional)

    Dimensions

    35.00mm × 55.00mm
    Retrieved from "https://wiki.icop.com.tw/product/index.php?title=NX8MMINI-D168&oldid=1818"