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<td style="width:250px; padding:5px 25px 5px 25px;"><a href="/index.php?title=File:SPEAR-MX8.png" class="image" title="SPEAR-MX8"><img alt="SPEAR-MX8" src="/images/thumb/f/f4/SPEAR-MX8.png/247px-SPEAR-MX8.png" width="247" height="200" srcset="/images/thumb/f/f4/SPEAR-MX8.png/370px-SPEAR-MX8.png 1.5x, /images/thumb/f/f4/SPEAR-MX8.png/494px-SPEAR-MX8.png 2x" /></a>
 
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<td style="padding:20px 30px 0px 0px; vertical-align:top; font-size:17px;">Supporting NXP's i.MX 8QuadMax, the SPEAR-MX8 allows designers to use a single System on Module in a broad range of applications to achieve short time-to-market for their current innovations, while still accommodating potential R&amp;D directions and marketing opportunities. This highly scalable SoM is an ideal solution for embedded products requiring advanced performance processing, high-end graphics, Ultra HD video capabilities and a variety of high-speed interfaces and connectivity options, such as USB3, CAN FD, and many more.<br><br><br>
 
<td style="padding:20px 30px 0px 0px; vertical-align:top; font-size:17px;">Supporting NXP's i.MX 8QuadMax, the SPEAR-MX8 allows designers to use a single System on Module in a broad range of applications to achieve short time-to-market for their current innovations, while still accommodating potential R&amp;D directions and marketing opportunities. This highly scalable SoM is an ideal solution for embedded products requiring advanced performance processing, high-end graphics, Ultra HD video capabilities and a variety of high-speed interfaces and connectivity options, such as USB3, CAN FD, and many more.<br><br><br>
 
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Revision as of 16:34, 24 February 2020

SPEAR-MX8
<a href="/index.php?title=File:SPEAR-MX8.png" class="image" title="SPEAR-MX8"><img alt="SPEAR-MX8" src="/images/thumb/f/f4/SPEAR-MX8.png/247px-SPEAR-MX8.png" width="247" height="200" srcset="/images/thumb/f/f4/SPEAR-MX8.png/370px-SPEAR-MX8.png 1.5x, /images/thumb/f/f4/SPEAR-MX8.png/494px-SPEAR-MX8.png 2x" /></a> Supporting NXP's i.MX 8QuadMax, the SPEAR-MX8 allows designers to use a single System on Module in a broad range of applications to achieve short time-to-market for their current innovations, while still accommodating potential R&D directions and marketing opportunities. This highly scalable SoM is an ideal solution for embedded products requiring advanced performance processing, high-end graphics, Ultra HD video capabilities and a variety of high-speed interfaces and connectivity options, such as USB3, CAN FD, and many more.


  • For more information on this product <a rel="nofollow" class="external text" href="https://www.variscite.com/product/system-on-module-som/cortex-a72/spear-mx8-nxp-imx8/">follow this link</a>.
  • Register at the <a rel="nofollow" class="external text" href="https://www.variscite.com/support/variscite-customer-portal">Variscite Customer Portal</a> to get high quality engineering support for this product.
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Yocto <a href=https://github.com/varigit/variscite-bsp-platform/releases.atom><img src=http://variwiki.com/images/1/1a/2000px-Rss-feed.png width=24 height=24 alt="Subscribe via rss"/></a>
Sumo (kernel 4.14.98)


Development

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Pie 9.0 (kernel 4.14.98)


Development

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Buster (kernel 4.14.98)


Development


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Specifications
CPUNXP i.MX 8QuadMax / 8QuadPlus:
2 / 1 × Cortex™-A72 1.8GHz
4 × Cortex™-A53 1.2GHz
2 × Cortex™-M4F 266MHz
MemoryUp to 8GB LPDDR4
GPU2 × Vivante™ GC7000/XSVX (8QuadMax)
2 × Vivante™ GC7000Lite/XSVX (8QuadPlus)
DisplayHDMI v2.0a up to 4Kp60,
eDP/DP,
LVDS Dual channel up to 1080p60                                             
StorageeMMC up to 64GB,
SD card
NetworkEthernet: 2 × 10/100/1000 Mbps,
WiFi: Certified 802.11 a/b/g/n/ac,
Bluetooth: 4.2, BLE
RTCOn carrier
I2C×4
SPI×4
UARTs×5
USB1 × USB 3.0 USB Type C,
1 × USB 2.0 OTG,
1 × USB HSIC
AudioHeadphone,
Digital/Analog stereo Microphone,
I2S(SAI), SPDIF, Line In/Out
Temperature Range-40 to 85°C
Dimensions55.0mm × 68.0mm