Difference between revisions of "第三層"
From ICOP tech wiki
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<td style="padding-left: 4%; padding-right: 4%; vertical-align:top; max-width:100%;"><b>General</b> | <td style="padding-left: 4%; padding-right: 4%; vertical-align:top; max-width:100%;"><b>General</b> | ||
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− | <li> <span class="plainlinks">[[第四層| | + | <li> <span class="plainlinks">[[第四層|工程師頁3-1]]</span> |
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− | <td> | + | <td>Build <span class="plainlinks"></span> |
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− | <td style="padding-left: 4%; padding-right: 4%; vertical-align:top; max-width:100%;"><b> | + | <td style="padding-left: 4%; padding-right: 4%; vertical-align:top; max-width:100%;"><b>Build Yocto, Linux and U-Boot</b> |
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− | <li> | + | <li> [[第四層-2|工程師頁3-2]] |
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<li> <span class="plainlinks">789</span> | <li> <span class="plainlinks">789</span> |
Revision as of 14:53, 27 February 2020
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Supporting NXP's i.MX 8QuadMax, the SPEAR-MX8 allows designers to use a single System on Module in a broad range of applications to achieve short time-to-market for their current innovations, while still accommodating potential R&D directions and marketing opportunities. This highly scalable SoM is an ideal solution for embedded products requiring advanced performance processing, high-end graphics, Ultra HD video capabilities and a variety of high-speed interfaces and connectivity options, such as USB3, CAN FD, and many more.
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