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<td style="padding-left: 4%; padding-right: 4%; vertical-align:top; max-width:100%;"><b><big>Pie 9.0</big><big>(kernel 4.14.98)</big></b><ul>
 
<td style="padding-left: 4%; padding-right: 4%; vertical-align:top; max-width:100%;"><b><big>Pie 9.0</big><big>(kernel 4.14.98)</big></b><ul>
<li> <span class="plainlinks"><big>[https://docs.google.com/spreadsheets/d/e/2PACX-1vRJvI9MSxmgWNGawAmtCmMVKIQhUxHays5Xfpdruge6B4amrq4LJhxI9U_aLPx8GpG-hODvtCWJUdMZ/pubhtml Release Notes]</big></span>
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<li> [https://docs.google.com/spreadsheets/d/e/2PACX-1vRJvI9MSxmgWNGawAmtCmMVKIQhUxHays5Xfpdruge6B4amrq4LJhxI9U_aLPx8GpG-hODvtCWJUdMZ/pubhtml <big>Release Notes</big>]</span>
 
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<li> [[1-1-4-1-2|Developers Guide]]
 
<li> [[1-1-4-1-2|Developers Guide]]

Revision as of 14:34, 12 March 2020

NX8MMINI-D168

Click me for the raw pictures.

NX8MMINI-D168

Providing an extremely small size board(35.00mm × 55.00mm), ICOP Technology launches a new ARM Cortex-A53 solution - NX8MMINI-D168. Equipping the NXP i.MX 8M Mini on ICOP’s unique DIP-168 module and provides an extensive I/O functions on board. The NX8MMINI-D168 provides I/O such as GPIO, UART, SD, DSI, CSI and High-quality audio based on S/PDIF or any interface based on SAI. For display, the IMX8MM-DIP168 supports up to 1080p encode and decode acceleration, 2D and 3D graphics.


For more information such as datasheet about this product please click.

Join the professional technical forum about NXP i.MX 8M Mini.



Yocto
Sumo (kernel 4.14.98)


Legacy releases


Development

Debian

Buster (kernel 4.14.78)


Development

Win10Iot
3 Getting Started


Android
Pie 9.0(kernel 4.14.98)


Legacy releases


Development

Boot2Qt

Boot2Qt Sumo

(Qt 5.12.7,

kernel 4.14.98)


Development

Specifications
CPUNXP i.MX 8M Mini:

Up to 4 × Cortex-A53 1.6GHz

1 × Cortex™-M4

MemoryUp to 8GB LPDDR4
GPUGC NanoUltra 3D (1 shader) GC320 2D OpenGL ES 2.0
DisplayMIPI-DSI up to 1080p60
StorageeMMC 16GB by default (up to 64GB)
SD card x2
NetworkEthernet: 10/100/1000 Mbps
RTCOn the carrier board
I2C×3
SPI×3
UARTs×4
USB2 × USB 2.0 OTG,
BUSPCIe
AudioHeadphone,
Digital/Analog stereo Microphone,
I2S(SAI), SPDIF, Line In/Out
Temperature Range-40 to 85°C
Dimensions35.00mm × 55.00mm