NX8MM-35

NX8MM-35

Features NXP i.MX 8M Mini Up to 4 × Cortex-A53 1.6GHz+ 1 × Cortex™-M4 I/O:4S/4U/GLAN/I2C/SPI/mPCIe/Wi-Fi/BT/MIPI-CSI/16bitGPIO/audio/MIPI-DSI or HDMI RAM: 2/4 GB LPDDR4 Form factor: 3.5" SBC(146 x 111 mm) Working temp.: -20° to 70° C or -40° to 80° C (Optional) Join the professional technical forum about NXP i.MX 8M Mini. Schematic of the carrier board. Brochure ODM/OEM project

Specifications

CPU	NXP i.MX 8M Mini: Up to 4 × Cortex-A53 1.6GHz 1 × Cortex™-M4
Memory	1/2/4 GB LPDDR4
GPU	GC NanoUltra 3D (1 shader) GC320 2D OpenGL ES 2.0
Display	HDMI 2.0/ MIPI DSI (Optional)
Storage	eMMC x1 (8~64G) Micro SD card x1
Network	Ethernet: 10/100/1000 Mbps, WiFi: Certified IEEE 802.11b/g/n Bluetooth: 4.1
SPI	QSPI optional
USB	3 × USB 2.0
Audio	1x Headphone 1x Speaker out 1x Mic-in
Temperature Range	0°C to +60°C or -20°C to +70°C(Optional)
Dimensions	146mmx102mm

Yocto

Kirkstone(kernel 5.15.71) Recipe eMMC image Hardknott(kernel 5.10.35) Recipe eMMC image Zeus(kernel 5.4.70) Recipe eMMC image Sumo(kernel 4.14.98) Recipe eMMC image Developer's Guide Software and Development Tool

Android

Pie(kernel 4.14.98) Developers Guide Recipe eMMC image Software and Development Tool